CALL FOR PAPERS
Material Physics
Physical Properties of Materials
Material Thermodynamics
Material Preparation Technology
Materials Engineering
Atomic Physics
Quantum Mechanics
Solid State Physics
Mechanical Properties of Materials
Optoelectronic Materials
Microelectronics Materials
Semiconductor
Superconductor
Nanomaterials and Nanotechnology
Nanofabrication
Material Processing
Engineering Structure
Structural Wind Engineering
Structural Monitoring
Structural Seismic Resistance, Vibration Reduction, and Vibration Control
Reliability and Durability of the Structure
Structural Load-bearing Capacity
Mechanical Properties of Engineering Structures and Materials
Structural Deformation and Failure
Submission Portal
If you have any questions or need any help about the conference, please feel free to contact our conference experts on the right:
· 王老师
· WeChat/TEL :132 6078 0457
· QQ:2031670594
· E-mail:icmpes@sub-paper.com
Important Dates
Submission Deadline:2026-10-14
Registration Deadline:2026-10-21
Conference Date:2026-10-28
Notification Date:About a week after the submission
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